Home > Taconic PCB > Taconic RF-35A2 PCB – 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) with Immersion Gold, Immersion Silver, and Blue Solder Mask
Taconic RF-35A2 PCB – 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) with Immersion Gold, Immersion Silver, and Blue Solder Mask

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Experience Superior Performance with Taconic RF-35A2 High-Frequency PCBs

Taconic RF-35A2 laminates are engineered for ultra-low loss, high-frequency applications, offering exceptional electrical performance and mechanical stability. With a dielectric constant (Dk) of 3.5 ±0.05 and a dissipation factor (Df) of 0.0015 at 10 GHz, RF-35A2 is the ideal choice for power amplifiers, filters, wireless antennas, and high-speed digital circuits.


Designed with ultra-low fiberglass content, RF-35A2 delivers best-in-class insertion loss properties and uniform dielectric constant, ensuring consistent performance across a wide range of applications. Its low thermal expansion coefficient and excellent peel strength make it a preferred material for surface mounting technology and chip carriers.

Key Features of Taconic RF-35A2 Laminates

1.Dielectric Constant (Dk): 3.5 ±0.05
2.Dissipation Factor (Df): 0.0015 at 10 GHz
3.Low Moisture Absorption: 0.03%, ensuring stability in various environments.
4.Thermal Conductivity: 0.29 W/mK
5.Low CTE: X-axis: 10 ppm/°C, Y-axis: 13 ppm/°C, Z-axis: 108 ppm/°C
6.Flame Retardant: Meets industry standards for safety and reliability.



Why Choose Taconic RF-35A2 Laminates?

Ultra-Low Loss Properties: Enhances performance in high-frequency applications.
Uniform Dielectric Constant:Ensures consistent electrical characteristics.
Excellent Peel Strength: Strong adhesion to copper layers for reliable performance.
Low Thermal Expansion: Ideal for surface mounting technology and chip carriers.
Low Moisture Absorption: Maintains stability in various environmental conditions.


Applications of Taconic RF-35A2 Laminates

Power Amplifiers
Filters and Couplers
High-Speed Digital Circuits
Passive Components
Wireless Antennas


Our PCB Capability (RF-35A2)

PCB Capability (RF-35A2)

PCB Material:

PTFE Ceramic Fiberglass

Designation:

RF-35A2

Dielectric constant:

3.15

Dissipation Factor

0.0015

Layer count:

Double Layer, Multilayer, Hybrid PCB

Copper weight:

0.5oz (17 µm), 1oz (35µm)

Laminate thickness:

10mil (0.254mm); 20mil (0.508mm),  30mil (0.762mm),  60mil (1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..


RF-35A2 Typical Values

Click to expand/collapse the table

RF-35A2 Typical Values

Property

Test Method

Unit

Value

Unit

Value

Dk @ 10 GHz

IPC-650 2.5.5.5.1 (Modified)

 

3.5

 

3.5

Df @ 10 GHz

IPC-650 2.5.5.5.1 (Modified)

 

0.0015

 

0.0015

Moisture Absorption

IPC-650 2.6.2.1

%

0.03

%

0.03

Dielectric Breakdown

IPC-650 2.5.6/ASTM D 149

kV

59

kV

59

Dielectric Strength

ASTM D 149

V/mil

1000

V/mm

39,370

Volume Resistivity

IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)

Mohm/cm

10^9

Mohm/cm

10^9

Surface Resistivity

IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)

Mohm

10^8

Mohm

10^8

Arc Resistance

IPC-650 2.5.1

Seconds

242

Seconds

242

Flexural Strength (MD)

IPC-650 2.4.4

kpsi

24

N/mm2

165

Flexural Strength (CD)

IPC-650 2.4.4

kpsi

15

N/mm2

103

Tensile Strength (MD)

ASTM D 3039

psi

16,800

N/mm2

116

Tensile Strength (CD)

ASTM D 3039

psi

11,000

N/mm2

75.8

Young’s Modulus (MD)

ASTM D 3039

psi

106

N/mm2

8,343

Young’s Modulus (CD)

ASTM D 3039

psi

106

N/mm2

7,171

Poisson’s Ratio (MD)

ASTM D 3039

 

0.14

 

0.14

Poisson’s Ratio (CD)

ASTM D 3039

 

0.1

 

0.1

Strain at Break (MD)

ASTM D 3039

%

1.6

%

1.6

Strain at Break (CD)

ASTM D 3039

%

1.4

%

1.4

Compressive Modulus   (Z axis)

ASTM D 695 (23°C)

kpsi

385

N/mm2

2,650

Peel Strength (1 oz. VLP)

IPC-650 2.4.8 (Thermal Stress)

lbs/in

12

N/mm

2.1

Peel Strength (1 oz. VLP)

IPC-650 2.4.8.3 (150°C ) (Elevated Temp.)

lbs/in

14

N/mm

2.5

Peel Strength (1 oz. VLP)

IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals)

lbs/in

11

N/mm

2

Density (Specific Gravity)

 

gm/cm3

2.28

gm/cm3

2.28

Specific Heat

ASTM E 1269 (DSC) (100°C)

J/g/K

0.99

J/g/K

0.99

Thermal Conductivity

ASTM F 433

W/M*K

0.29

W/M*K

0.29

Td

IPC-650 2.4.24.6 2% Weight Loss

°C

528

°C

528

Td

IPC-650 2.4.24.6 5% Weight Loss

°C

547

°C

547

CTE (x)

IPC-650 2.4.41 (>RT - 125°C)

ppm/°C

10

ppm/°C

10

CTE (y)

IPC-650 2.4.41 (>RT - 125°C)

ppm/°C

13

ppm/°C

13

CTE (z)

IPC-650 2.4.41 (>RT - 125°C)

ppm/°C

108

ppm/°C

108


Upgrade Your RF PCB Designs with Taconic RF-35A2!

Whether you're working on power amplifiers, wireless antennas, or high-speed digital circuits, Taconic RF-35A2 laminatesoffer the perfect combination of performance, reliability, and low loss properties. With ultra-low insertion loss, uniform dielectric constant, and excellent peel strength, RF-35A2 is the ideal choice for your next high-frequency PCB project.



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